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concept design for a low cost BGA96 interposer using uncovered vias as pads. the vias are 0.2mm drill, 0.4mm top; the idea is to place 0.35mm solder balls onto them. no idea whether this will work reliably, but it avoids via-in-pad so it can be fabricated cheaply.

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also no idea whether the impedance discontinuity from the connectors will be too much for DDR3L. it's probably fine? it isn't in the 3D model but they have a contact that runs down the middle for ground referencing, so you don't have to put VSS on 1/3 of your pins.

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