concept design for a low cost BGA96 interposer using uncovered vias as pads. the vias are 0.2mm drill, 0.4mm top; the idea is to place 0.35mm solder balls onto them. no idea whether this will work reliably, but it avoids via-in-pad so it can be fabricated cheaply.


also no idea whether the impedance discontinuity from the connectors will be too much for DDR3L. it's probably fine? it isn't in the 3D model but they have a contact that runs down the middle for ground referencing, so you don't have to put VSS on 1/3 of your pins.

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